Quectel M66-DS-TE-A

Quectel M66-DS-TE-A is an ultra-small Dual SIM Dual Standby quad-band GSM/GPRS module using LCC castellation package. Based on the latest 2G chipset, it has the optimal performance in SMS & data transmission and audio service even in harsh environment. The Dual SIM Dual Standby function allows customers to use two (U)SIM cards in one device simultaneously. The ultra-compact 15.8mm × 17.7mm × 2.3mm profile makes M66-DS a perfect platform for size sensitive applications.

Overview

M66-DS adopts surface mount technology, making it an ideal solution for durable and rugged designs. The low profile and small size of LCC package ensures M66-DS can be easily embedded into low-volume applications and provides reliable connectivity for the applications. This kind of package is ideally suited for large-scale manufacturing which has strict requirements for cost and efficiency. The compact form factor, low power consumption and two (U)SIM card interfaces make M66-DS the best choice for applications such as wearable device, automotive, industrial PDA, personal tracking, wireless POS, smart metering, telematics and other M2M applications

Key Benefits

● Ultra compact form factor with Dual SIM Dual Standby (DSDS) feature
● Easier soldering process with LCC package
● Power consumption as low as 1.3mA
● Support Voice, Bluetooth and QuecFOTATM
● Embedded powerful Internet service protocols, multiple Sockets & IP addresses
● Testing Adapter & Evaluation Board for Quectel M66-DS Module
● Performance testing
● Testing adapter is that a Quectel module is embedded on the Printed Circuit Board (PCB) and can be plugged into the Evaluation Board for performance testing